Chengdu Hongke
Chengdu Hongke Electronic Technology Co., Ltd. was established in April 1999 and is located in the Longquanyi Industrial Zone of Chengdu Economic and Technological Development Area, Sichuan Province. The company was jointly founded by Chengdu Hongming Electronics Co., Ltd.—a renowned Chinese enterprise ranked among the top 100 electronic component manufacturers—and Chengdu State-owned Assets Venture Capital Co., Ltd., among others. It has become a key supplier of multilayer ceramic chip capacitors (commonly known as MLCCs), ceramic materials used in chip capacitors, and related ceramic components in China.
Our company boasts strong technical expertise and state-of-the-art equipment, having successfully introduced advanced production machinery and testing technologies from countries such as the United States, Germany, and Japan. In terms of foundational materials, we operate a "High-Quality Ceramic Material Production Line" and a "High-Quality Electrode Paste Facility," positioning us as a leader in the R&D and manufacturing of electronic functional ceramics and electrode pastes.
On the product front, we maintain multiple specialized production lines, including an "Aerospace-Grade Multilayer Ceramic Dielectric Capacitor Line," a "High-Quality High-Voltage Ceramic Dielectric Capacitor Line," a "Chip Capacitor Production Line," a "High-Quality Multi-Core Group Capacitor Line," a "Ceramic Filter Production Line," a "Microwave Devices/Components Production Line," and an "LTCC Production Line."
Additionally, our robust testing capabilities are supported by a nationally accredited "Testing and Experiment Center," equipped with advanced facilities for environmental testing, secondary screening, and failure analysis.
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2026 MCU Industry Outlook: Market Expansion, Technological Upgrades, and Supply Chain Restructuring
In 2026, the global microcontroller (MCU) industry is expected to maintain steady growth, driven by robust demand across multiple sectors, including automotive electrification, industrial automation, and IoT and AI infrastructure. At the same time, supply-chain constraints and successive price hikes will persist throughout the year. International industry leaders are accelerating their localization strategies, while domestic manufacturers continue to make breakthroughs in high-end offerings and product differentiation.
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Building 3, Zhujiang Moore International Building, Beiqing Road, Changping District, Beijing
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