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Helping Chinese electronic components go global and realizing China's chip dream.
Full-industry-chain integration, covering all product categories
Seamlessly connecting the industry's upstream and downstream sectors, while aggregating global electronic component resources.
Providing electronic component selection solutions for both domestic and international end-users.
We offer a full range of products and can provide customized development services tailored to your specific needs.
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SINCE 2019
Beijing IC-DREAM International Technology Co., Ltd.
Beijing IC-DREAM International Technology Co., Ltd. (referred to as "IC-DREAM International"), established in 2019, is a specialized high-tech company dedicated to promoting and applying China-originated electronic components. Through deep collaboration with more than 120 Chinese manufacturers of electronic components and with the support of industry-related organizations—including standards and testing bodies—the company has successfully integrated the entire electronics component value chain. The company’s clientele spans across key sectors such as aerospace, automotive, industrial, medical, and transportation industries. Its business offerings encompass several key areas: 1. **Information Consulting**: Providing comprehensive information services to both domestic and international players in the electronics industry, including organizing international exhibitions and sales events for electronic components, developing product promotion strategies, facilitating technical exchanges, and managing import/export activities. 2. **Component Selection Solutions**:
Manufacturer
Aerospace Research Institute 771
The Xi'an Institute of Microelectronics Technology (also known as Lishan Microelectronics Company, Xi'an Institute 771, and the 771st Research Institute of the Ninth Academy, China Aerospace Science and Technology Corporation) is affiliated with the Ninth Academy of the China Aerospace Science and Technology Corporation. It specializes in the research, development, production, and testing of cutting-edge technologies across three key fields: computers, semiconductor integrated circuits, and hybrid integration. As the nation’s only large-scale, specialized institute integrating research, development, and manufacturing in these three critical areas—computers, semiconductor ICs, and hybrid integration—it also served as the founding institution behind ZTE Corporation, one of the world’s top 100 IT companies. Moreover, the institute has been a pioneering force and a leading contributor to China’s aerospace microelectronics and computing industries.
Established in October 1965, the Xi'an Institute of Microelectronics Technology has earned numerous prestigious awards, including multiple National First-Class Awards for Scientific and Technological Progress and Special Prizes from the National Defense Science and Technology Progress Awards. The institute has also received accolades such as the National May Day Labor Medal, the Outstanding Contribution Award for High-Tech Equipment Development Projects, the Outstanding Contribution Unit for China’s Chang’e-2 Lunar Exploration Mission, as well as titles like "Advanced Collective of Shaanxi Province" and "Model Civilized Unit of Shaanxi Province."
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Aerospace Research Institute No. 772
The Beijing Institute of Microelectronics Technology, established in 1994 and affiliated with the Ninth Academy of China Aerospace Science and Technology Corporation, is a national-level engineering research institute specializing in the development of aerospace-grade and highly reliable ultra-large-scale integrated circuits. The institute’s radiation-resistant components and technologies related to the "BeiDou-2" project have collectively earned numerous prestigious national science and technology awards, including the State Technological Progress Grand Prize and the State First-Class Award for Invention. Additionally, its flip-chip packaging technology has been recognized with both the China Quality Award and China’s first-ever Patent Gold Award in the military component sector. As of 2019, the institute boasts a first-tier master’s program in Electronic Science and Technology, as well as a postdoctoral workstation, having trained over 170 graduate students to date. It has also established collaborative training partnerships with several leading universities. Headquartered in Beijing, the institute maintains branch offices in Xi'an, Shanghai, and Shenzhen, playing a critical role in supplying integrated circuits for key national projects.
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Shanghai Fudan Microelectronics Group Co., Ltd. (hereinafter FMSH) is a domestic leading company specializing in the design, development, production (testing), and system solution provision of super-large-scale integration. Founded in July 1998, FMSH was listed in Hong Kong in 2000 (stock code: 01385.HK), and transferred to the Main Board of Hong Kong in 2014. FMSH is the earliest and first listed joint-stock IC design company in China. In 2021, FMSH is listed on the SSE STAR Market and forms into the capital structure of “A+H”.
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China Electronics Technology Group Corporation No. 13 Institute
The China Electronics Technology Group Corporation's 13th Research Institute, founded in Beijing in 1956 and relocated to Shijiazhuang, Hebei Province, in 1963, is a leading, innovation-driven, and comprehensive research institution specializing in core semiconductor electronic components. It boasts significant scale, robust technical capabilities, and a fully integrated professional structure. As a vital supplier of high-end, cutting-edge electronic components and a pioneering hub for innovation in new semiconductor devices and technologies in China, the 13th Institute focuses on five key technological areas: microelectronics, optoelectronics, Micro-Electro-Mechanical Systems (MEMS), advanced semiconductor sensors, and optomechatronic integrated microsystems. Additionally, it emphasizes foundational support areas such as electronic packaging, materials science, and metrology testing.
Since its establishment, the institute has achieved over 60 domestic firsts in the semiconductor field and has accumulated more than 3,100 scientific research breakthroughs. Among these, 63 achievements have earned national-level awards, while 500 have received recognition at the ministerial or provincial level. Furthermore, over 550 research projects have reached internationally leading or advanced standards. In 2020, the institute generated revenues of 8.1 billion yuan and has maintained an A-grade performance rating in the group’s annual assessments for nine consecutive years.
Today, the 13th Institute employs over 7,000 staff members, including 577 professionals holding mid- to senior-level technical titles. Notably, the institute is home to two Group Chief Scientists, three Chief Experts, seven experts who receive special government allowances, and one individual recognized under the National “Hundred, Thousand, Ten Thousand Talents” Program.
The institute operates across two main facilities—the headquarters and the Western Research & Production Zone—covering a total area of 1,500 mu. It comprises four major business divisions, five innovation centers, and 12 controlled subsidiaries. Equipped with nine state-of-the-art R&D and production lines, the 13th Institute has successfully obtained both GJB9001C-2017 and GB-T19001-2016 quality system certifications. It also hosts several prestigious institutions, including a Key National Defense Science and Technology Laboratory, the Innovation Center for Component Packaging Technologies in the Defense Industry, the National Semiconductor Device Quality Supervision and Inspection Center, the Level-2 Metrology Station No. 1312 for the Defense Industry, and the National 863 Program Base for Optoelectronic Device Industrialization, along with a dedicated MEMS Process and Packaging Base.
As a recognized institution for master’s degree programs in engineering and a joint doctoral training partner, the 13th Institute also maintains a thriving postdoctoral research workstation. Moreover, it publishes and distributes two nationally recognized core journals: *Semiconductor Technology* and *Micro-Nano Electronic Technology*.
The 13th Institute has established a fully independent and controllable technology ecosystem spanning from materials and design to advanced manufacturing processes, testing, and packaging. This integrated approach enables it to deliver a comprehensive product supply chain—from individual chips and components to sophisticated integrated microsystems. Its products are widely deployed in critical electronic systems across naval, land, air, and aerospace applications, firmly positioning the institute as a cornerstone in achieving self-reliance and control over core electronic components for China’s defense and military equipment.
Beyond its core defense applications, the 13th Institute is actively expanding into emerging strategic sectors such as microwave and RF communications, electronic ceramic packaging, power electronics for renewable energy, and advanced sensor technologies. The institute has forged strong technical partnerships with globally renowned companies and research institutions, fostering extensive collaboration and knowledge exchange. As a result, its products not only meet the growing demand for domestic substitution but are also exported to over 20 countries and regions worldwide.
Looking ahead, the 13th Institute remains steadfast in its commitment to national security and technological independence. Rooted in Hebei Province, it continues to champion self-reliance and innovation, dedicating itself wholeheartedly to advancing China’s semiconductor industry. By doing so, the institute underscores its unwavering dedication to becoming a trusted "national strategic asset" in the realm of core semiconductor components—a testament to its pivotal role in safeguarding and strengthening China’s technological sovereignty.
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How to Use a Multiphase Boost Converter
When the required system voltage exceeds the available supply voltage, a boost converter is typically an ideal solution. However, conventional standard boost topologies are not the only option. In certain application scenarios, phase-shifted multiphase boost converters can deliver superior performance: these converters achieve higher efficiency under heavy-load conditions while significantly reducing the required capacitance values for both the input and output stages.
2026-04-03
GigaDevice announced that its 1.2V ultra-low-power SPI NOR Flash GD25UF series has now expanded its capacity lineup from 8 Mb to 256 Mb. This move precisely addresses the diversified storage requirements across a wide range of applications, from high-performance AI computing to low-power battery-powered devices. Leveraging its significant advantages of low voltage and ultra-low power consumption, this product provides robust support for rapidly growing emerging markets such as wearable devices, smart headphones, AI ASIC platforms, and medical electronics. While substantially extending the battery life of end devices, it will also further drive product development toward edge AI and extreme miniaturization, accelerating the innovative upgrade of next-generation smart terminals.
2026-03-20
Since March 2026, the global semiconductor industry has been poised for a new round of price hikes. Major international chip design firms—Texas Instruments (TI), Infineon, and NXP—have successively issued price adjustment notices to their customers, announcing that they will increase the prices of certain products effective April 1. At the same time, the impact of these price increases has already rippled from upstream chip manufacturers all the way to end-consumer markets, with frequent announcements of price adjustments in sectors such as smartphones and cloud services. The entire industry chain is now facing a new round of cost pressures.
2026-03-19