Self-developed “chip” breakthrough! Hangyuwei proudly receives the “China Chip” Award.
The 2025 China Chip Integrated Circuit Industry Promotion Conference and the 20th China Chip Outstanding Product Selection Results Announcement Ceremony were held from November 13 to 14 at the Tianmu Qintai Conference Center in Hengqin, Zhuhai. This year’s conference is themed “Chips Give Rise to All Things, Intelligent Computing Knows No Bounds,” and aims to promote industrial innovation and collaboration.
(At the conference venue)
In this selection, the “Servo Control Chip Based on SIP Technology/CSTSIP-SC-X,” independently developed by Zhuhai Hangyu Micro Technology Co., Ltd. (hereinafter referred to as “Hangyu Micro”), was awarded the 2025 “China Chip” Outstanding Technological Innovation Product prize. This award focuses on chip products that have been successfully developed within the past two years, demonstrate technological innovation and independent intellectual property rights, and play a proactive role in promoting the localization of the industrial chain.
The “China Chip” Outstanding Products Selection was launched in 2006 and has become one of the most influential events in China’s integrated circuit industry. This year’s selection attracted a total of 303 companies and 410 products, making the competition particularly fierce.
It is reported that the CSTSIP-SC-X chip, which has won this award for Hangyuwei, employs system-in-package (SiP) technology. Through three-dimensional stacking packaging, it achieves multi-layer integration of the drive circuit, control circuit, and power circuit, and adopts an isolated design in both the communication and drive sections. This chip features a compact structure and high reliability, making it suitable for applications in high-end industrial control, aerospace, and other fields that demand high precision and low power consumption.
Publicly available information shows that Hangyu Wei has been investing in the field of 3D packaging SiP technology for many years and possesses end-to-end technical capabilities spanning chip design, packaging, and testing. The company has successively launched a variety of microsystem modules and chip products based on SiP technology.
Against the backdrop of today’s integrated circuit industry, which emphasizes independent innovation and supply-chain security, advanced packaging technologies such as SiP are seen as one of the key pathways to enhancing chip performance and achieving heterogeneous integration. This award received by Hangyuwei reflects that its R&D achievements in system-level packaging technology have gradually gained industry recognition.
(Source: Zhuhai Hangyu Micro Technology Co., Ltd.; please contact us to remove any content if you have concerns about copyright infringement.)
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