Unisplendour National Silicon
Xi'an UniIC Semiconductors Co., Ltd. (“Xi’an UniIC” in short) was originally the Memory Division of Xi’an R&D Center of Infineon Technologies established in 2004. The memory division became an independent company Qimonda Technologies (Xi’an) Co., Ltd. after its spin-off in 2006. The entity was acquired by Inspur Group due to Qimonda worldwide insolvency and started as a local company Xi’an Sinochip Semiconductors Co., Ltd. in 2009. In 2015, the company was taken over by Tsinghua Unigroup and renamed as Xi’an UniIC. It became a share-holding company and begins a new era of development in 2023.
Xi’an UniIC is a product and service provider focusing on DRAM (Dynamic Random Access Memory) technologies. Its core business includes standard memory chips, module and system products, embedded DRAM and memory controller chips, as well as ASIC design services. The company has advanced R&D capabilities, rich experience in design, testing and mass production, as well as a well-established product development process and quality management system. The complete product portfolio and category include DRAM KGD, DRAM components, MCP, and DRAM modules, which have filled the gap of many high-end products in the domestic semiconductor memory industry.
Meanwhile, Xi’an UniIC has successfully developed the embedded DRAM chips with ultra-high bandwidth, ultra-large density and ultra-low power consumption; multiple high-performance SoC chips stacked with this embedded DRAM chip using WoW technology have achieved mass production and volume shipment in the past a couple of years. These achievements have also been invited to industry top journals and meetings such as IEDM 2020, CICC 2021, IMW 2021, A-SSCC 2021, ISSCC 2022 and VLSI 2023 to deliver reports and papers.
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2026 MCU Industry Outlook: Market Expansion, Technological Upgrades, and Supply Chain Restructuring
In 2026, the global microcontroller (MCU) industry is expected to maintain steady growth, driven by robust demand across multiple sectors, including automotive electrification, industrial automation, and IoT and AI infrastructure. At the same time, supply-chain constraints and successive price hikes will persist throughout the year. International industry leaders are accelerating their localization strategies, while domestic manufacturers continue to make breakthroughs in high-end offerings and product differentiation.
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Building 3, Zhujiang Moore International Building, Beiqing Road, Changping District, Beijing
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