Aerospace Research Institute No. 772

Aerospace Research Institute No. 772


The Beijing Institute of Microelectronics Technology, established in 1994 and affiliated with the Ninth Academy of China Aerospace Science and Technology Corporation, is a national-level engineering research institute specializing in the development of aerospace-grade and highly reliable ultra-large-scale integrated circuits. The institute’s radiation-resistant components and technologies related to the "BeiDou-2" project have collectively earned numerous prestigious national science and technology awards, including the State Technological Progress Grand Prize and the State First-Class Award for Invention. Additionally, its flip-chip packaging technology has been recognized with both the China Quality Award and China’s first-ever Patent Gold Award in the military component sector. As of 2019, the institute boasts a first-tier master’s program in Electronic Science and Technology, as well as a postdoctoral workstation, having trained over 170 graduate students to date. It has also established collaborative training partnerships with several leading universities. Headquartered in Beijing, the institute maintains branch offices in Xi'an, Shanghai, and Shenzhen, playing a critical role in supplying integrated circuits for key national projects.

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